rev 0 heat sink question

[mr.kaeru]

Hi all,

I have a rev 0 Japanese model equipped with the heat pipes.
I noticed recently that the smaller heat sink (I think these are heat sinks?) is not "glued" to the piece (processor?) it is supposed to absorb the heat from. It is actually not attached at all...



When putting the console back together I could check that the part that goes on top of the motherboard pushes the heat sink down so it constantly stays in contact.

However I am wondering whether this is normal? if it should be glued?
I assume that if the console was over heating, it would just self reboot eventually. Would that be a correct symptom? (I have none of this at the moment).

Thanks for your help

[mstar]

Well, one thing's for certain, the heatsink should stay in place - although not being glued down but affixed with some heat transfer adhesive / thermal pads.

I've a VA0 PAL model as well and recently bought new Thermal Pads from Aliexpress - although i didn't have the time to rip it apart just yet (or the last 12 months *cough*) - so, i can't say for certain i've bought the right ones.

https://de.aliexpress.com/item/33040781 ... 42a76f2576

[mr.kaeru]

Thanks for your reply mstar.

That's what I thought... well if you get the chance to open it, please let me know whether these are the right size.

Thanks

[mr.kaeru]

sorry for the double post.

What thickness should I get?

[mstar]

I've got the 1.5mm thick ones - at least that is what i think i found out while reading which ones to get, please do your own research though, as i said i still don't know for certain if they're the right size&thickness for certain!